Data Sheets/QIDI/PLA Basic

QIDI PLA Basic

Complete technical data sheet with print conditions, material properties, and performance specifications.

Product Information

ManufacturerQIDI
Product NamePLA Basic
Filament TypePLA
FinishStandard

Print Conditions

Nozzle Temperature210-230 °C
Bed Temperature50-60 °C
Print Speed30-50 mm/s

Technical Properties

Tensile Strength36.82 MPa ±6ISO 527
Tensile Strength (Z)32.46 MPa ±6ISO 527
Elongation at Break (X-Y)5.36 % ±3ISO 527
Elongation at Break (Z)1.52 % ±1ISO 527
Tensile Modulus (X-Y)2189.2 MPa ±100ISO 527
Tensile Modulus (Z)2121.4 MPa ±100ISO 527
Flexural Strength (X-Y)61.29 MPa ±4ISO 178
Flexural Strength (Z)41.38 MPa ±4ISO 178
Flexural Modulus (X-Y)2286.98 MPa ±100ISO 178
Flexural Modulus (Z)2135.04 MPa ±100ISO 178
Unnotched Charpy impact strength (X-Y)17.84 kJ/m² ±2ISO 179
Unnotched Charpy impact strength (Z)7.23 kJ/m² ±1ISO 179
Unnotched Izod Impact (X-Y)15.87 kJ/m² ±2ISO 179
Unnotched Izod Impact (Z)7.03 kJ/m² ±1ISO 179
Water Absorption0.6 %ISO 62
Density1.17 g/cm³ISO 1183
Melt Index2-7 g/10 minISO 1133
Glass Transition Temperature65.5 °CDSC, 10 °C/min
Melting Point107.7 °CDSC, 10 °C/min
Crystallization Temperature147.8 °CDSC, 10 °C/min
Heat Deflection Temperature @ 0.45MPa55.3 °CISO 75
Heat Deflection Temperature @ 1.8MPa54.8 °CISO 75
Vicat Softening Temperature59.6 °CISO 306, GB/T 1633

Additional Characteristics

Effect of Weak AcidsNot ResistantData Sheet
Effect of Strong AcidsNot ResistantData Sheet
Effect of Weak AlkalisNot ResistantData Sheet
Effect of Strong AlkalisNot ResistantData Sheet
Chemical resistance: organic solventsNot ResistantData Sheet

Other documentation

Technical Data SheetView Data SheetVersion 2.1 · 2025-10
PLA Basic on qidi3d.comOpen link

This data sheet is for quick reference only. Data is sourced from manufacturer specifications and should be verified. Always confirm specifications on the manufacturer's official website before making purchasing or design decisions. Report any issues or discrepancies using the button on the right.